? all specifications are subject to change without notice. conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications. inductors for standard circuits multilayer/std magnetic shielded mlf series type: issue date: mlf1005l 1005[0402 inch]* mlf1608 1608[0603 inch] mlf2012 2012[0805 inch] * dimensions code jis[eia] november 2011
all specifications are subject to change without notice. (1/9) 001-05 / 20111129 / e511_mlf_02 inductors for standard circuits multilayer/std ? magnetic shielded mlf series mlf1005l various digital devices are required to be further downsized yet remain highly functional, and to excel in low power consumption, and parts mounted on the devices are also required to have lower resistance. the mlf1005l type is a new line of inductors that have been developed to meet such requirements: their resistance has been lowered by up to 35% in comparison with that of the existing mlf1005 type. in addition, the new inductors use similar magnetic shielding, which enables their high-density mounting. features the resistance of the mlf1005l type has been lowered by up to 35% in comparison with that of the existing mlf1005 type. magnetically shielded configuration allowing for high-density mounting. does not contain lead and is compatible with lead-free soldering. it is a product conforming to rohs directive. applications signal processing modules such as cellular phones and tuners specifications recommended soldering condition reflow soldering product identification (1) series name (2) dimensions l w (3) type name (4) inductance (5) tolerance (6) packaging style (7) tdk internal code packaging style and quantities handling and precautions before soldering, be sure to preheat components. the preheating temperature should be set so that the tempera- ture difference between the solder temperature and product temperature does not exceed 150c. after mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. the inductance value may change due to magnetic saturation if the current exceeds the rated maximum. do not expose the inductors to stray magnetic fields. avoid static electricity discharge during handling. when hand soldering, apply the soldering iron to the printed cir- cuit board only. temperature of the iron tip should not exceed 350c. soldering time should not exceed 3 seconds. conformity to rohs directive operating temperature range ?40 to +85c storage temperature range ?40 to +85c(after mount) natural cooling 10s max. preheating 60 to 120s soldering 30 to 60s 230?c 250 to 260?c 180?c 150?c time(s) mlf 1005 l r10 k t (1) (2) (3) (4) (5) (6) (7) 1005 1.0 0.5 0.5 l low-resistance type r10 0.1 h 1r0 1.0 h k 10% t taping [reel] packaging style quantity taping 10000 pieces/reel please contact our sales office when your application is considered the following: the device?s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications.
all specifications are subject to change without notice. (2/9) 001-05 / 20111129 / e511_mlf_02 shapes and dimensions/recommended pc board pattern electrical characteristics typical electrical characteristics inductance vs. frequency characteristics q vs. frequency characteristics impedance vs. frequency characteristics inductance (h) inductance tolerance te s t frequency l, q (mhz) te s t current l, q (ma) q min. self-resonant frequency (mhz)min. dc resistance ( ? )max. rated current (ma)max. part no. 0.1 10% 25 1.0 10 450 0.51 150 mlf1005lr10kt 0.12 10% 25 1.0 10 400 0.59 140 mlf1005lr12kt 0.15 10% 25 1.0 10 350 0.63 130 mlf1005lr15kt 0.18 10% 25 1.0 10 320 0.76 120 mlf1005lr18kt 0.22 10% 25 1.0 10 290 0.79 110 mlf1005lr22kt 0.27 10% 25 1.0 10 260 0.91 100 mlf1005lr27kt 0.33 10% 25 1.0 10 230 1.05 90 mlf1005lr33kt 0.39 10% 10 1.0 25 210 0.41 50 mlf1005lr39kt 0.47 10% 10 1.0 25 190 0.42 50 mlf1005lr47kt 0.56 10% 10 1.0 25 170 0.47 45 mlf1005lr56kt 0.68 10% 10 1.0 25 150 0.55 40 mlf1005lr68kt 0.82 10% 10 1.0 25 130 0.59 35 mlf1005lr82kt 1.0 10% 10 1.0 25 120 0.64 35 mlf1005l1r0kt 1.2 10% 10 1.0 25 110 0.79 35 mlf1005l1r2kt 1.5 10% 10 1.0 25 100 0.95 30 mlf1005l1r5kt 1.8 10% 10 1.0 25 90 1.05 20 mlf1005l1r8kt 2.2 10% 10 1.0 25 80 1.15 15 mlf1005l2r2kt 0.50.05 0.50.05 0.1min. 0.1min. 1.00.05 weight : 1.2mg dimensions in mm 0.4 0.5 0.5 0.5 1 0.01 10 0.1 1 inductance ( h ) frequency ( mhz ) 2.2h 0.1h 0.33h 1.0h 10 100 1000 1 0 10 100 1000 q frequency ( mhz ) 2.2h 1.0h 0.1h 0.33h 10 20 30 40 50 70 60 1 1 10000 1000 10 100 impedance ( ? ) frequency ( mhz ) 2.2h 0.1h 0.33h 1.0h 10 100 1000
all specifications are subject to change without notice. (3/9) 001-05 / 20111129 / e511_mlf_02 packaging styles reel dimensions tape dimensions 1.0 ?180 2.0 2.0 0.5 ?13 0.2 ?21 0.8 ?60min. 14.4max. dimensions in mm 8.4 +2.0 ?0.0 8.00.3 3.50.05 1.750.1 4.0 0.1 2.0 0.05 2.0 0.05 1.5 +0.1 ?0.0 sprocket hole cavity 1.150.1 0.8max. 0.65 0.1 160min. taping 200min. 300min. drawing direction dimensions in mm
all specifications are subject to change without notice. (4/9) 001-05 / 20111129 / e511_mlf_02 inductors for standard circuits multilayer/std magnetic shielded mlf series mlf1608 features high-reliability monolithic structure. ferrite core and magnetic shielding enables the design of com- pact circuits with high density mounting. excellent solderability and high heat resistance permits either flow or reflow soldering. the products contain no lead and also support lead-free soldering. it is a product conforming to rohs directive. applications digital cellular phone, tuner, personal computers, audio, or various electronic appliances specifications recommended soldering condition reflow soldering product identification (1) series name (2) dimensions l w (3) type name (4) inductance (5) tolerance (6) packaging style (7) tdk internal code packaging style and quantities handling and precautions before soldering, be sure to preheat components. the preheating temperature should be set so that the tempera- ture difference between the solder temperature and product temperature does not exceed 150c. after mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. the inductance value may change due to magnetic saturation if the current exceeds the rated maximum. do not expose the inductors to stray magnetic fields. avoid static electricity discharge during handling. when hand soldering, apply the soldering iron to the printed cir- cuit board only. temperature of the iron tip should not exceed 350c. soldering time should not exceed 3 seconds. conformity to rohs directive operating temperature range ?40 to +85c storage temperature range ?40 to +85c(after mount) natural cooling 10s max. preheating 60 to 120s soldering 30 to 60s 230?c 250 to 260?c 180?c 150?c time(s) mlf 1608 a 1r0 k t (1) (2) (3) (4) (5) (6) (7) 1608 1.6 0.8mm 47n 47nh[0.047 h] r15 0.15 h 1r0 1 h k 10% m 20% t taping [reel] packaging style quantity taping 4000 pieces/reel please contact our sales office when your application is considered the following: the device?s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications.
all specifications are subject to change without notice. (5/9) 001-05 / 20111129 / e511_mlf_02 shapes and dimensions/recommended pc board pattern electrical characteristics ? 47n means for 47nh (0.047h). test equipment inductance, q: ag4294a-16034g inductance (h) inductance tolerance q te s t frequency l, q (mhz) te s t current l, q (ma) self-resonant frequency (mhz) dc resistance ( ? ) rated current (ma)max. part no. min. typ. min. typ. max. typ. 0.047 20% 10 20 50 1.0 600 900 0.20 0.10 200 mlf1608d47n ? mt 0.068 20% 10 20 50 1.0 550 700 0.30 0.15 200 mlf1608d68nmt 0.082 20% 10 20 50 1.0 500 650 0.30 0.15 200 mlf1608d82nmt 0.1 10% 15 25 25 1.0 450 600 0.35 0.20 200 mlf1608dr10kt 0.12 10% 15 25 25 1.0 400 550 0.40 0.20 200 mlf1608dr12kt 0.15 10% 15 25 25 1.0 350 500 0.45 0.25 200 mlf1608dr15kt 0.18 10% 15 25 25 1.0 320 450 0.50 0.25 150 mlf1608dr18kt 0.22 10% 15 25 25 1.0 290 400 0.55 0.30 150 mlf1608dr22kt 0.27 10% 15 25 25 1.0 260 350 0.60 0.35 150 mlf1608dr27kt 0.33 10% 15 25 25 1.0 230 320 0.75 0.40 100 mlf1608dr33kt 0.39 10% 15 25 25 1.0 210 290 0.85 0.45 100 mlf1608dr39kt 0.47 10% 15 30 25 1.0 190 260 0.95 0.50 100 mlf1608dr47kt 0.56 10% 15 30 25 1.0 170 230 1.05 0.55 100 mlf1608dr56kt 0.68 10% 15 30 25 1.0 150 210 1.25 0.65 70 mlf1608dr68kt 0.82 10% 15 30 25 1.0 130 190 1.40 0.75 70 mlf1608dr82kt 1 10% 35 50 10 1.0 120 170 0.50 0.25 50 mlf1608a1r0kt 1.2 10% 35 50 10 1.0 110 150 0.65 0.25 50 mlf1608a1r2kt 1.5 10% 35 55 10 1.0 100 140 0.70 0.30 50 mlf1608a1r5kt 1.8 10% 35 55 10 1.0 90 130 0.85 0.35 50 mlf1608a1r8kt 2.2 10% 35 55 10 1.0 80 120 1.00 0.45 30 mlf1608a2r2kt 2.7 10% 35 55 10 1.0 70 110 1.15 0.50 30 mlf1608a2r7kt 3.3 10% 35 60 10 1.0 65 100 1.30 0.55 30 mlf1608a3r3kt 3.9 10% 35 60 10 1.0 60 90 1.45 0.65 30 mlf1608a3r9kt 4.7 10% 35 60 10 1.0 55 80 1.60 0.75 30 mlf1608a4r7kt 5.6 10% 35 60 4 0.1 45 70 1.10 0.55 15 mlf1608e5r6kt 6.8 10% 35 60 4 0.1 40 60 1.30 0.65 15 mlf1608e6r8kt 8.2 10% 35 60 4 0.1 35 55 1.50 0.80 10 mlf1608e8r2kt 10 10% 30 55 2 0.1 30 50 1.70 1.00 10 mlf1608e100kt 12 10% 30 55 2 0.1 25 45 1.80 1.20 10 mlf1608e120kt 15 10% 20 40 1 0.1 22 42 1.50 0.80 2 mlf1608c150kt 18 10% 20 40 1 0.1 20 40 1.60 0.85 2 mlf1608c180kt 22 10% 20 40 1 0.1 18 38 1.70 0.90 2 mlf1608c220kt 27 10% 20 40 1 0.1 15 35 1.80 1.20 2 mlf1608c270kt 33 10% 20 40 1 0.1 10 30 2.20 1.40 2 mlf1608c330kt 0.3 0.2 1.6 0.15 0.8 0.15 0.8 0.6 0.6 0.8 0.8 0.15 dimensions in mm weight: 4mg
all specifications are subject to change without notice. (6/9) 001-05 / 20111129 / e511_mlf_02 typical electrical characteristics inductance change vs. dc superposition characteristics inductance change vs. temperature characteristics impedance vs. frequency characteristics q vs. frequency characteristics packaging styles reel dimensions tape dimensions 100 10 1 0.1 0.01 1 5 10 50 100 500 1000 dc current ( ma ) inductance ( h ) 22h 8.2h 1h 0.068h 0 ?5 ?10 25 50 85 temperature ( ?c ) ? l/l ( % ) 0 ?25 10 5 22h 0.68h 8.2h 1h 1h 8.2h 0.68h 22h 22h 8.2h 1h 0.68h 100 10 1 0.1 0.01 1 5 10 50 100 500 1000 frequency ( mhz ) impedance ( k? ) 22h 8.2h 1h 0.68h 80 60 40 20 0 0.1 0.5 1 5 10 50 100 5001000 q frequency ( mhz ) 1.0 ?180 2.0 2.0 0.5 ?13 0.2 ?21 0.8 ?60min. 14.4max. dimensions in mm 8.4 +2.0 ?0.0 8.00.3 3.50.05 1.90.2 1.750.1 1.1max. 1.1 0.2 4.0 0.1 4.0 0.1 2.0 0.05 1.5 +0.1 ?0.0 sprocket hole cavity 160min. taping 200min. 300min. drawing direction dimensions in mm
all specifications are subject to change without notice. (7/9) 001-05 / 20111129 / e511_mlf_02 inductors for standard circuits multilayer/std magnetic shielded mlf series mlf2012 features high-reliability monolithic structure. ferrite core and magnetic shielding enables the design of com- pact circuits with high density mounting. excellent solderability and high heat resistance permits either flow or reflow soldering. the products contain no lead and also support lead-free soldering. it is a product conforming to rohs directive. applications digital cellular phone, car audio, tv, personal computers, or vari- ous electronic appliances specifications recommended soldering condition reflow soldering product identification (1) series name (2) dimensions l w (3) type name (4) inductance (5) tolerance (6) packaging style (7) tdk internal code packaging style and quantities handling and precautions before soldering, be sure to preheat components. the preheating temperature should be set so that the tempera- ture difference between the solder temperature and product temperature does not exceed 150c. after mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. the inductance value may change due to magnetic saturation if the current exceeds the rated maximum. do not expose the inductors to stray magnetic fields. avoid static electricity discharge during handling. when hand soldering, apply the soldering iron to the printed cir- cuit board only. temperature of the iron tip should not exceed 350c. soldering time should not exceed 3 seconds. conformity to rohs directive operating temperature range ?40 to +85c storage temperature range ?40 to +85c(after mount) natural cooling 10s max. preheating 60 to 120s soldering 30 to 60s 230?c 250 to 260?c 180?c 150?c time(s) mlf 2012 a 1r0 k t (1) (2) (3) (4) (5) (6) (7) 2012 2.0 1.25mm 47n 47nh[0.047 h] r15 0.15 h 1r0 1 h 100 10h k 10% m 20% t taping [reel] packaging style product?s thickness quantity taping 0.85mm 4000 pieces/reel 1.25mm 2000 pieces/reel please contact our sales office when your application is considered the following: the device?s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications.
all specifications are subject to change without notice. (8/9) 001-05 / 20111129 / e511_mlf_02 shapes and dimensions/recommended pc board pattern electrical characteristics ? 47n means for 47nh (0.047h). test equipment inductance, q: ag4294a-16034g inductance (h) inductance tolerance q te s t frequency l, q (mhz) test current l, q (ma) self-resonant frequency (mhz) dc resistance ( ? ) rated current (ma)max. thickness t (mm) part no. min. typ. min. typ. max. typ. 0.047 20% 15 25 50 1.0 550 700 0.10 0.05 300 0.85 mlf2012d47n ? mt 0.068 20% 15 25 50 1.0 500 600 0.15 0.08 300 0.85 mlf2012d68nmt 0.082 20% 15 25 50 1.0 450 550 0.15 0.08 300 0.85 mlf2012d82nmt 0.1 10% 20 30 25 1.0 400 500 0.15 0.10 300 0.85 mlf2012dr10kt 0.12 10% 20 30 25 1.0 360 450 0.20 0.12 300 0.85 mlf2012dr12kt 0.15 10% 20 30 25 1.0 320 410 0.20 0.13 300 0.85 mlf2012dr15kt 0.18 10% 20 30 25 1.0 280 370 0.25 0.15 300 0.85 mlf2012dr18kt 0.22 10% 20 30 25 1.0 250 330 0.30 0.16 250 0.85 mlf2012dr22kt 0.27 10% 20 30 25 1.0 220 300 0.35 0.18 250 0.85 mlf2012dr27kt 0.33 10% 20 30 25 1.0 200 270 0.40 0.23 250 0.85 mlf2012dr33kt 0.39 10% 25 35 25 1.0 180 250 0.45 0.25 200 0.85 mlf2012dr39kt 0.47 10% 25 35 25 1.0 160 230 0.50 0.25 200 1.25 mlf2012dr47kt 0.56 10% 25 35 25 1.0 150 210 0.55 0.30 150 1.25 mlf2012dr56kt 0.68 10% 25 35 25 1.0 140 190 0.60 0.35 150 1.25 mlf2012dr68kt 0.82 10% 25 35 25 1.0 130 170 0.65 0.40 150 1.25 mlf2012dr82kt 1 10% 45 55 10 1.0 120 160 0.30 0.15 80 0.85 mlf2012a1r0kt 1.2 10% 45 55 10 1.0 110 150 0.35 0.15 80 0.85 mlf2012a1r2kt 1.5 10% 45 60 10 1.0 100 140 0.40 0.18 80 0.85 mlf2012a1r5kt 1.8 10% 45 60 10 1.0 90 130 0.45 0.20 80 0.85 mlf2012a1r8kt 2.2 10% 45 60 10 1.0 80 120 0.50 0.22 50 0.85 MLF2012A2R2Kt 2.7 10% 45 70 10 1.0 70 100 0.55 0.25 50 1.25 mlf2012a2r7kt 3.3 10% 45 70 10 1.0 60 90 0.60 0.28 50 1.25 mlf2012a3r3kt 3.9 10% 45 70 10 1.0 55 80 0.65 0.30 30 1.25 mlf2012a3r9kt 4.7 10% 45 70 10 1.0 50 70 0.70 0.35 30 1.25 mlf2012a4r7kt 5.6 10% 50 75 4 0.1 45 65 0.60 0.30 15 1.25 mlf2012e5r6kt 6.8 10% 50 75 4 0.1 40 60 0.65 0.32 15 1.25 mlf2012e6r8kt 8.2 10% 50 75 4 0.1 35 55 0.70 0.35 15 1.25 mlf2012e8r2kt 10 10% 50 75 2 0.1 30 50 0.80 0.40 15 1.25 mlf2012e100kt 12 10% 50 75 2 0.1 25 45 0.90 0.50 15 1.25 mlf2012e120kt 15 10% 30 45 1 0.1 22 40 0.70 0.35 5 1.25 mlf2012c150kt 18 10% 30 45 1 0.1 20 38 0.80 0.38 5 1.25 mlf2012c180kt 22 10% 30 45 1 0.1 18 35 0.90 0.45 5 1.25 mlf2012c220kt 27 10% 30 45 1 0.1 17 33 1.00 0.50 5 1.25 mlf2012c270kt 33 10% 30 45 0.4 0.1 15 28 1.10 0.55 5 1.25 mlf2012c330kt 39 10% 35 55 2 0.1 13 23 2.40 1.30 4 1.25 mlf2012k390kt 47 10% 35 55 2 0.1 11 20 2.70 1.60 4 1.25 mlf2012k470kt 56 10% 35 55 2 0.1 10 18 2.80 1.80 4 1.25 mlf2012k560kt 68 10% 25 45 1 0.1 9 16 2.90 2.00 2 1.25 mlf2012c680kt 82 10% 25 45 1 0.1 8 14 3.00 2.40 2 1.25 mlf2012c820kt 100 10% 25 45 1 0.1 7 12 3.10 2.50 2 1.25 mlf2012c101kt 0.5 0.3 1.25 0.2 1 0.8 0.8 1.2 t dimensions in mm 2.0 0.2 t ( thickness ) 0.850.2 1.250.2 weight ( mg ) 10 14
all specifications are subject to change without notice. (9/9) 001-05 / 20111129 / e511_mlf_02 typical electrical characteristics inductance change vs. dc superposition characteristics inductance change vs. temperature characteristics impedance vs. frequency characteristics q vs. frequency characteristics packaging styles reel dimensions tape dimensions 100 10 1 0.1 0.01 1 5 10 50 100 500 1000 dc current ( ma ) inductance ( h ) 22h 10h 0.1h 1h 0 ?4 ?8 ?12 ?16 25 50 85 10h 0.1h 22h 0.1h 1h 10h temperature ( ?c ) ? l/l ( % ) 0 ?25 12 8 4 1h 22h frequency ( mhz ) 22h 10h 1h 0.1h 1 5 10 50 100 500 1000 100 10 1 0.1 0.01 impedance ( k? ) 0.1 0.5 1 5 10 50 100 5001000 80 60 40 20 0 q frequency ( mhz ) 10h 1h 22h 0.1h 1.0 ?180 2.0 2.0 0.5 ?13 0.2 ?21 0.8 ?60min. 14.4max. dimensions in mm 8.4 +2.0 ?0.0 8.00.3 3.50.05 1.750.1 1.1max. 4.0 0.1 4.0 0.1 2.0 0.05 1.5 +0.1 ?0.0 sprocket hole cavity 2.30.2 1.5 0.2 160min. taping 200min. 300min. drawing direction dimensions in mm 8.00.3 3.50.05 1.750.1 0.3max. 4.0 0.1 4.0 0.1 2.0 0.05 1.5 +0.1 ?0.0 sprocket hole 0.5min. cavity 2.30.2 1.5max. 1.5 0.2 t=0.85mm t=1.25mm
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